Dicing tape "RMGU"
Tape (UV-curable) for protecting and securing wafers during the semiconductor dicing process.
1. Excellent scalability. 2. Low wafer contamination.
- Company:KGK 共同技研化学 埼玉県所沢本社・工場、群馬県富岡工場、東京都池袋事業所
- Price:Other
1~1 item / All 1 items
Tape (UV-curable) for protecting and securing wafers during the semiconductor dicing process.
1. Excellent scalability. 2. Low wafer contamination.